Wedge bonding

Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry.

Wafer bonding techniques used in ICs, MEMS, and NEMS

Substrate bonding	Direct bonding Plasma-activated bonding Anodic bonding Eutectic bonding Glass frit bonding Adhesive bonding Thermocompression bonding Transient liquid phase diffusion bonding Surface activated bonding

Connections	Compliant bonding Wire bonding Ball bonding Thermosonic bonding Tape-automated bonding (TAB)

See also	Bond characterization

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