Intel Core

This article is about the Intel processor brand name. For the Intel microarchitecture that is the basis for the Core 2 processor family, see Intel Core (microarchitecture).

Intel Core is Intel's brand name for various mid-range to high-end home and business microprocessors. These processors displaced the existing mid-to-high end Pentium processors of the time, moving the Pentium to the entry level, and bumping the Celeron series of processors to low end. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets.

As of 2016 the current lineup of Core processors included the Intel Core i7, Intel Core i5, Intel Core i3, Intel Core m7, Intel Core m5 and Intel Core m3.[1]

Outline

Although Intel Core is a brand that promises no internal consistency or continuity, the processors within this family have been, for the most part, broadly similar.

The first products receiving this designation were the Core Solo and Core Duo Yonah processors for mobile from the Pentium M design tree, fabricated at 65 nm and brought to market in January 2006. These are substantially different in design than the rest of the Intel Core product group, having derived from the Pentium Pro lineage that predated Pentium 4.

The first Intel Core desktop processor—and typical family member—came from the Conroe iteration, a 65 nm dual-core design fabricated brought to market in July 2006, based on the all-new Intel Core microarchitecture with substantial enhancements in micro-architectural efficiency and performance, outperforming Pentium 4 across the board (or near to it), while operating at drastically lower clock rates. Maintaining high instructions per cycle (IPC) on a deeply pipelined and resourced out-of-order execution engine has remained a constant fixture of the Intel Core product group ever since.

The next substantial bump in microarchitecture came with the introduction of the 45 nm Bloomfield desktop processor in November 2008 on the Nehalem architecture, whose main advantage came from redesigned I/O and memory systems featuring the new Intel QuickPath Interconnect and an integrated memory controller supporting up to three channels of DDR3 memory.

Subsequent performance improvements have tended toward making addition rather than profound change, such as adding the Advanced Vector Extensions instruction set extensions to Sandy Bridge, first released on 32 nm in January 2011. Time has also brought improved support for virtualization and a trend toward higher levels of system integration and management functionality through the ongoing evolution of facilities such as Intel Active Management Technology.

Overview

Brand Desktop Mobile
Code-named Cores Fab Date released Code-named Cores Fab Date released
Core Solo
Desktop version not available
Yonah 1 65 nm January 2006
Core Duo
Desktop version not available
Yonah 2 65 nm January 2006
Core 2 Solo
Desktop version not available
Merom-L
Penryn-L
1
1
65 nm
45 nm
September 2007
May 2008
Core 2 Duo Conroe
Allendale
Wolfdale
2
2
2
65 nm
65 nm
45 nm
August 2006
January 2007
January 2008
Merom
Penryn
2
2
65 nm
45 nm
July 2006
January 2008
Core 2 Quad Kentsfield
Yorkfield
4
4
65 nm
45 nm
January 2007
March 2008
Penryn 4 45 nm August 2008
Core 2 Extreme Conroe XE
Kentsfield XE
Yorkfield XE
2
4
4
65 nm
65 nm
45 nm
July 2006
November 2006
November 2007
Merom XE
Penryn XE
Penryn XE
2
2
4
65 nm
45 nm
45 nm
July 2007
January 2008
August 2008
Core M
Desktop version not available
Broadwell 2 14 nm September 2014[2]
Core m3
Desktop version not available
Skylake
Kaby Lake
2
2
14 nm
14 nm
August 2015
August 2016
Core m5
Desktop version not available
Skylake 2 14 nm August 2015
Core m7
Desktop version not available
Skylake 2 14 nm August 2015
Core i3 Clarkdale
Sandy Bridge
Ivy Bridge
Haswell
Skylake
Kaby Lake
2
2
2
2
2
2
32 nm
32 nm
22 nm
22 nm
14 nm
14 nm
January 2010
February 2011
September 2012
September 2013
September 2015
2017
Arrandale
Sandy Bridge
Ivy Bridge
Haswell
Broadwell
Skylake
Kaby Lake
2
2
2
2
2
2
2
32 nm
32 nm
22 nm
22 nm
14 nm
14 nm
14 nm
January 2010
February 2011
June 2012
June 2013
January 2015
September 2015
August 2016
Core i5 Lynnfield
Clarkdale
Sandy Bridge
Sandy Bridge
Ivy Bridge
Ivy Bridge
Haswell
Haswell
Broadwell
Skylake
Kaby Lake
4
2
4
2
4
2
4
2
4
4
4
45 nm
32 nm
32 nm
32 nm
22 nm
22 nm
22 nm
22 nm
14 nm
14 nm
14 nm
September 2009
January 2010
January 2011
February 2011
April 2012
April 2012
June 2013
June 2013
June 2015
September 2015
2017
Arrandale
Sandy Bridge
Ivy Bridge
Haswell
Broadwell
Skylake
Skylake
Kaby Lake
Kaby Lake
2
2
2
2
2
4
2
2
4
32 nm
32 nm
22 nm
22 nm
14 nm
14 nm
14 nm
14 nm
14 nm
January 2010
February 2011
May 2012
June 2013
January 2015
September 2015
September 2015
August 2016
2017
Core i7 Bloomfield
Lynnfield
Gulftown
Sandy Bridge
Sandy Bridge-E
Sandy Bridge-E
Ivy Bridge
Haswell
Ivy Bridge-E
Ivy Bridge-E
Haswell-E
Broadwell
Skylake
Kaby Lake
4
4
6
4
6
4
4
4
4
6
6
4
4
4
45 nm
45 nm
32 nm
32 nm
32 nm
32 nm
22 nm
22 nm
22 nm
22 nm
22 nm
14 nm
14 nm
14 nm
November 2008
September 2009
July 2010
January 2011
November 2011
February 2012
April 2012
June 2013
September 2013
September 2013
August 2014
June 2015
September 2015
2017
Clarksfield
Arrandale
Sandy Bridge
Sandy Bridge
Ivy Bridge
Ivy Bridge
Haswell
Haswell
Broadwell
Broadwell
Skylake
Skylake
Kaby Lake
Kaby Lake
4
2
4
2
4
2
4
2
2
4
4
2
2
4
45 nm
32 nm
32 nm
32 nm
22 nm
22 nm
22 nm
22 nm
14 nm
14 nm
14 nm
14 nm
14 nm
14 nm
September 2009
January 2010
January 2011
February 2011
May 2012
May 2012
June 2013
June 2013
January 2015
June 2015
September 2015
September 2015
August 2016
2017
Core i7
Extreme Edition
Bloomfield
Gulftown
Sandy Bridge-E
Ivy Bridge-E
Haswell-E

Broadwell-E

4
6
6
6
8

10

45 nm
32 nm
32 nm
22 nm
22 nm

14 nm

November 2008
March 2010
November 2011
September 2013
August 2014

Q2' 16

Clarksfield
Sandy Bridge
Ivy Bridge
Haswell
4
4
4
4
45 nm
32 nm
22 nm
22 nm
September 2009
January 2011
May 2012
June 2013

List of Intel Core microprocessors
List of Intel Core 2 microprocessors
List of Intel Core M microprocessors
List of Intel Core i3 microprocessors
List of Intel Core i5 microprocessors
List of Intel Core i7 microprocessors

Clock speed slowest 1.2 GHz to the fastest 4.0 GHz (Intel Core i7-4790K) (or 4.4 GHz via Intel Turbo Boost Technology)[3]

Enhanced Pentium M based

For details about the processor core, see Yonah (microprocessor).

The original Core brand refers to Intel's 32-bit mobile dual-core x86 CPUs, which derived from the Pentium M branded processors. The processor family used a enhanced version of the Intel P6 microarchitecture. It emerged in parallel with the NetBurst microarchitecture (Intel P68) of the Pentium 4 brand, and was a precursor of the 64-bit Core microarchitecture of Core 2 branded CPUs. The Core brand comprised two branches: the Duo (dual-core) and Solo (Duo with one disabled core, which replaced the Pentium M brand of single-core mobile processor).

Intel launched the Core brand on January 6, 2006 with the release of the 32-bit Yonah CPU – Intel's first dual-core mobile (low-power) processor. Its dual-core layout closely resembled two interconnected Pentium M branded CPUs packaged as a single die (piece) silicon chip (IC). Hence, the 32-bit microarchitecture of Core branded CPUs – contrary to its name – had more in common with Pentium M branded CPUs than with the subsequent 64-bit Core microarchitecture of Core 2 branded CPUs. Despite a major rebranding effort by Intel starting January 2006, some companies continued to market computers with the Yonah core marked as Pentium M.

The Core series is also the first Intel processor used as the main CPU in an Apple Macintosh computer. The Core Duo was the CPU for the first generation MacBook Pro, while the Core Solo appeared in Apple's Mac Mini line. Core Duo signified the beginning of Apple's shift to Intel processors across their entire line.

In 2007, Intel began branding the Yonah core CPUs intended for mainstream mobile computers as Pentium Dual-Core, not to be confused with the desktop 64-bit Core microarchitecture CPUs also branded as Pentium Dual-Core.

September 2007 and January 4, 2008 marked the discontinuation of a number of Core branded CPUs including several Core Solo, Core Duo, Celeron and one Core 2 Quad chip.[4][5]

Core Duo

Intel Core Duo[6] (product code 80539) consists of two cores on one die, a 2 MB L2 cache shared by both cores, and an arbiter bus that controls both L2 cache and FSB (front-side bus) access.

Codename
(main article)
Brand name (list) L2 Cache Socket TDP
Yonah Core Duo T2xxx 2 MB Socket M 31 W
Core Duo L2xxx 15 W
Core Duo U2xxx 9 W

Core Solo

Intel Core Solo[7] (product code 80538) uses the same two-core die as the Core Duo, but features only one active core. Depending on demand, Intel may also simply disable one of the cores to sell the chip at the Core Solo price—this requires less effort than launching and maintaining a separate line of CPUs that physically only have one core. Intel used the same strategy previously with the 486 CPU in which early 486SX CPUs were in fact manufactured as 486DX CPUs but with the FPU disabled.

Codename
(main article)
Brand name (list) L2 Cache Socket TDP
Yonah Core Solo T1xxx 2 MB Socket M 27–31 W
Core Solo U1xxx 5.5–6 W

64-bit Core microarchitecture-based

The successor to Core is the mobile version of the Intel Core 2 line of processors using cores based upon the Intel Core microarchitecture,[8] released on July 27, 2006. The release of the mobile version of Intel Core 2 marks the reunification of Intel's desktop and mobile product lines as Core 2 processors were released for desktops and notebooks, unlike the first Intel Core CPUs that were targeted only for notebooks (although some small form factor and all-in-one desktops, like the iMac and the Mac Mini, also used Core processors).

Unlike the Intel Core, Intel Core 2 is a 64-bit processor, supporting Intel 64. Another difference between the original Core Duo and the new Core 2 Duo is an increase in the amount of Level 2 cache. The new Core 2 Duo has tripled the amount of on-board cache to 6 MB. Core 2 also introduced a quad-core performance variant to the single- and dual-core chips, branded Core 2 Quad, as well as an enthusiast variant, Core 2 Extreme. All three chips are manufactured at a 65 nm lithography, and in 2008, a 45 nm lithography and support Front Side Bus speeds ranging from 533 MHz to 1600 MHz. In addition, the 45 nm die shrink of the Core microarchitecture adds SSE4.1 support to all Core 2 microprocessors manufactured at a 45 nm lithography, therefore increasing the calculation rate of the processors.

Core 2 Solo

The Core 2 Solo,[9] introduced in September 2007, is the successor to the Core Solo and is available only as an ultra-low-power mobile processor with 5.5 Watt thermal design power. The original U2xxx series "Merom-L" used a special version of the Merom chip with CPUID number 10661 (model 22, stepping A1) that only had a single core and was also used in some Celeron processors. The later SU3xxx are part of Intel's CULV range of processors in a smaller µFC-BGA 956 package but contain the same Penryn chip as the dual-core variants, with one of the cores disabled during manufacturing.

Codename
(main article)
Brand name (list) L2 Cache Socket TDP
Merom-L Mobile Core 2 Solo U2xxx 1 MB FCBGA 5.5 W
Penryn-L Mobile Core 2 Solo SU3xxx 3 MB BGA956 5.5 W

Core 2 Duo

The majority of the desktop and mobile Core 2 processor variants are Core 2 Duo[10][11] with two processor cores on a single Merom, Conroe, Allendale, Penryn, or Wolfdale chip. These come in a wide range of performance and power consumption, starting with the relatively slow ultra-low-power Uxxxx (10 W) and low-power Lxxxx (17 W) versions, to the more performance oriented Pxxxx (25 W) and Txxxx (35 W) mobile versions and the Exxxx (65 W) desktop models. The mobile Core 2 Duo processors with an 'S' prefix in the name are produced in a smaller µFC-BGA 956 package, which allows building more compact laptops.

Within each line, a higher number usually refers to a better performance, which depends largely on core and front-side bus clock frequency and amount of second level cache, which are model-specific. Core 2 Duo processors typically use the full L2 cache of 2, 3, 4, or 6 MB available in the specific stepping of the chip, while versions with the amount of cache reduced during manufacturing are sold for the low-end consumer market as Celeron or Pentium Dual-Core processors. Like those processors, some low-end Core 2 Duo models disable features such as Intel Virtualization Technology.

Codename
(main article)
Brand name (list) L2 Cache Socket TDP
Merom Mobile Core 2 Duo U7xxx 2 MB BGA479 10 W
Mobile Core 2 Duo L7xxx 4 MB 17 W
Mobile Core 2 Duo T5xxx 2 MB Socket M
Socket P
BGA479
35 W
Mobile Core 2 Duo T7xxx 2–4 MB
Conroe and
Allendale
Core 2 Duo E4xxx 2 MB LGA 775 65 W
Core 2 Duo E6xxx 2–4 MB
Penryn Mobile Core 2 Duo SU7xxx 3 MB BGA956 10 W
Mobile Core 2 Duo SU9xxx
Mobile Core 2 Duo SL9xxx 6 MB 17 W
Mobile Core 2 Duo SP9xxx 25 W
Mobile Core 2 Duo P7xxx 3 MB Socket P
FCBGA6
25 W
Mobile Core 2 Duo P8xxx
Mobile Core 2 Duo P9xxx 6 MB
Mobile Core 2 Duo T6xxx 2 MB 35 W
Mobile Core 2 Duo T8xxx 3 MB
Mobile Core 2 Duo T9xxx 6 MB
Mobile Core 2 Duo E8xxx 6 MB Socket P 35-55 W
Wolfdale Core 2 Duo E7xxx 3 MB LGA 775 65 W
Core 2 Duo E8xxx 6 MB

Core 2 Quad

Core 2 Quad[12][13] processors are multi-chip modules consisting of two dies similar to those used in Core 2 Duo, forming a quad-core processor. This allows twice the performance of a dual-core processors at the same clock frequency in ideal conditions.

Initially, all Core 2 Quad models were versions of Core 2 Duo desktop processors, Kentsfield derived from Conroe and Yorkfield from Wolfdale, but later Penryn-QC was added as a high-end version of the mobile dual-core Penryn.

The Xeon 32xx and 33xx processors are mostly identical versions of the desktop Core 2 Quad processors and can be used interchangeably.

Codename
(main article)
Brand name (list) L2 Cache Socket TDP
Kentsfield Core 2 Quad Q6xxx 2×4 MB LGA 775 95–105 W
Yorkfield Core 2 Quad Q7xxx 2×1 MB 95 W
Core 2 Quad Q8xxx 2×2 MB 65–95 W
Core 2 Quad Q9xxx 2×3–2×6 MB
Penryn-QC Mobile Core 2 Quad Q9xxx 2×3–2×6 MB Socket P 45 W

Core 2 Extreme

Core 2 Extreme processors[14][15] are enthusiast versions of Core 2 Duo and Core 2 Quad processors, usually with a higher clock frequency and an unlocked clock multiplier, which makes them especially attractive for overclocking. This is similar to earlier Pentium processors labeled as Extreme Edition. Core 2 Extreme processors were released at a much higher price than their regular version, often $999 or more.

Codename
(main article)
Brand name (list) L2 Cache Socket TDP
Merom Mobile Core 2 Extreme X7xxx 4 MB Socket P 44 W
Conroe Core 2 Extreme X6xxx 4 MB LGA 775 75 W
Kentsfield Core 2 Extreme QX6xxx 2×4 MB LGA 775 130 W
Penryn Mobile Core 2 Extreme X9xxx 6 MB Socket P 44 W
Penryn-QC Mobile Core 2 Extreme QX9xxx 2×6 MB Socket P 45 W
Yorkfield Core 2 Extreme QX9xxx 2×6 MB LGA 775 / LGA 771 130–150 W

Nehalem microarchitecture-based

With the release of the Nehalem microarchitecture in November 2008,[16] Intel introduced a new naming scheme for its Core processors. There are three variants, Core i3, Core i5 and Core i7, but the names no longer correspond to specific technical features like the number of cores. Instead, the brand is now divided from low-level (i3), through mid-range (i5) to high-end performance (i7),[17] which correspond to three, four and five stars in Intel's Intel Processor Rating[18] following on from the entry-level Celeron (one star) and Pentium (two stars) processors.[19] Common features of all Nehalem based processors include an integrated DDR3 memory controller as well as QuickPath Interconnect or PCI Express and Direct Media Interface on the processor replacing the aging quad-pumped Front Side Bus used in all earlier Core processors. All these processors have 256 KB L2 cache per core, plus up to 12 MB shared L3 cache. Because of the new I/O interconnect, chipsets and mainboards from previous generations can no longer be used with Nehalem-based processors.

Core i3

Intel intended the Core i3 as the new low end of the performance processor line from Intel, following the retirement of the Core 2 brand.[20][21]

The first Core i3 processors were launched on January 7, 2010.[22]

The first Nehalem based Core i3 was Clarkdale-based, with an integrated GPU and two cores.[23] The same processor is also available as Core i5 and Pentium, with slightly different configurations.

The Core i3-3xxM processors are based on Arrandale, the mobile version of the Clarkdale desktop processor. They are similar to the Core i5-4xx series but running at lower clock speeds and without Turbo Boost.[24] According to an Intel FAQ they do not support Error Correction Code (ECC) memory.[25] According to motherboard manufacturer Supermicro, if a Core i3 processor is used with a server chipset platform such as Intel 3400/3420/3450, the CPU supports ECC with UDIMM.[26] When asked, Intel confirmed that, although the Intel 5 series chipset supports non-ECC memory only with the Core i5 or i3 processors, using those processors on a motherboard with 3400 series chipsets it supports the ECC function of ECC memory.[27] A limited number of motherboards by other companies also support ECC with Intel Core ix processors; the Asus P8B WS is an example, but it does not support ECC memory under Windows non-server operating systems.[28]

Codename
(main article)
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
Clarkdale Core i3 2 4 MB LGA 1156 73 W Direct Media Interface,
Integrated GPU
Arrandale Core i3-3xxM 3 MB rPGA-988A 35 W
Core i3-3xxUM 3 MB BGA-1288 18 W

Core i5

The first Core i5 using the Nehalem microarchitecture was introduced on September 8, 2009, as a mainstream variant of the earlier Core i7, the Lynnfield core.[29][30] Lynnfield Core i5 processors have an 8 MB L3 cache, a DMI bus running at 2.5 GT/s and support for dual-channel DDR3-800/1066/1333 memory and have Hyper-threading disabled. The same processors with different sets of features (Hyper-Threading and other clock frequencies) enabled are sold as Core i7-8xx and Xeon 3400-series processors, which should not be confused with high-end Core i7-9xx and Xeon 3500-series processors based on Bloomfield. A new feature called Turbo Boost Technology was introduced which maximizes speed for demanding applications, dynamically accelerating performance to match the workload.

The Core i5-5xx mobile processors are named Arrandale and based on the 32 nm Westmere shrink of the Nehalem microarchitecture. Arrandale processors have integrated graphics capability but only two processor cores. They were released in January 2010, together with Core i7-6xx and Core i3-3xx processors based on the same chip. The L3 cache in Core i5-5xx processors is reduced to 3 MB, while the Core i5-6xx uses the full cache and the Core i3-3xx does not support for Turbo Boost.[31] Clarkdale, the desktop version of Arrandale, is sold as Core i5-6xx, along with related Core i3 and Pentium brands. It has Hyper-Threading enabled and the full 4 MB L3 cache.[32]

According to Intel "Core i5 desktop processors and desktop boards typically do not support ECC memory",[33] but information on limited ECC support in the Core i3 section also applies to Core i5 and i7.

Codename
(main article)
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
Lynnfield Core i5-7xx 4 8 MB LGA 1156 95 W Direct Media Interface
Core i5-7xxS 82 W
Clarkdale Core i5-6xx 2 4 MB 73–87 W Direct Media Interface,
Integrated GPU
Arrandale Core i5-5xxM 3 MBrPGA-988A 35 W
Core i5-4xxM
Core i5-5xxUMBGA-1288 18 W
Core i5-4xxUM[34]

Core i7

Intel Core i7 as an Intel brand name applies to several families of desktop and laptop 64-bit x86-64 processors using the Nehalem, Westmere, Sandy Bridge, Ivy Bridge, Haswell, Broadwell and Skylake microarchitectures. The Core i7 brand targets the business and high-end consumer markets for both desktop and laptop computers,[35] and is distinguished from the Core i3 (entry-level consumer), Core i5 (mainstream consumer), and Xeon (server and workstation) brands.

Intel introduced the Core i7 name with the Nehalem-based Bloomfield Quad-core processor in late 2008.[36][37][38][39] In 2009 new Core i7 models based on the Lynnfield (Nehalem-based) desktop quad-core processor and the Clarksfield (Nehalem-based) quad-core mobile were added,[40] and models based on the Arrandale dual-core mobile processor (also Nehalem-based) were added in January 2010. The first six-core processor in the Core lineup is the Nehalem-based Gulftown, which was launched on March 16, 2010. Both the regular Core i7 and the Extreme Edition are advertised as five stars in the Intel Processor Rating.

In each of the first three microarchitecture generations of the brand, Core i7 has family members using two distinct system-level architectures, and therefore two distinct sockets (for example, LGA 1156 and LGA 1366 with Nehalem). In each generation, the highest-performing Core i7 processors use the same socket and QPI-based architecture as the medium-end Xeon processors of that generation, while lower-performing Core i7 processors use the same socket and PCIe/DMI/FDI architecture as the Core i5.

"Core i7" is a successor to the Intel Core 2 brand.[41][42][43][44] Intel representatives stated that they intend the moniker Core i7 to help consumers decide which processor to purchase as Intel releases newer Nehalem-based products in the future.[45]

Code name Brand name Cores L3 Cache Socket TDP Process Busses Release
Date
Gulftown Core i7-9xxX Extreme Edition 6 12 MB LGA 1366 130 W 32 nm QPI,
3 × DDR3
Mar 2010
Core i7-970 Jul 2010
Bloomfield Core i7-9xx Extreme Edition 4 8 MB 45 nm Nov 2008
Core i7-9xx (except Core i7-970/980)
Lynnfield Core i7-8xx LGA 1156 95 W DMI,
PCI-e,
2 × DDR3
Sep 2009
Core i7-8xxS 82 W Jan 2010
Clarksfield Core i7-9xxXM Extreme Edition rPGA-988A 55 W Sep 2009
Core i7-8xxQM 45 W
Core i7-7xxQM 6 MB
Arrandale Core i7-6xxM 2 4 MB 35 W 32 nm DMI,
PCI-e,
FDI,
2 × DDR3
Jan 2010
Core i7-6xxLMBGA-1288 25 W
Core i7-6xxUM 18 W

Sandy Bridge (2nd gen) microarchitecture-based

Main article: Sandy Bridge

In early 2011, Intel introduced a new microarchitecture named Sandy Bridge. This is the 2nd generation Core processor microarchitecture. It kept all the existing brands from Nehalem, including Core i3/i5/i7, and introduced new model numbers. The initial set of Sandy Bridge processors includes dual- and quad-core variants, all of which use a single 32 nm die for both the CPU and integrated GPU cores, unlike the earlier microarchitectures. All Core i3/i5/i7 processors with the Sandy Bridge microarchitecture have a four-digit model number. With the mobile version, the thermal design power can no longer be determined from a one- or two-letter suffix but is encoded into the CPU number. Starting with Sandy Bridge, Intel no longer distinguishes the code names of the processor based on number of cores, socket or intended usage; they all use the same code name as the microarchitecture itself.

Ivy Bridge is the codename for Intel's 22 nm die shrink of the Sandy Bridge microarchitecture based on tri-gate ("3D") transistors, introduced in April 2012.

Core i3

Released on January 20, 2011, the Core i3-2xxx line of desktop and mobile processors is a direct replacement of the 2010 "Clarkdale" Core i3-5xx and "Arrandale" Core i3-3xxM models, based on the new microarchitecture. While they require new sockets and chipsets, the user-visible features of the Core i3 are largely unchanged, including the lack of support for Turbo Boost and AES-NI. Unlike the Sandy Bridge-based Celeron and Pentium processors, the Core i3 line does support the new Advanced Vector Extensions. This particular processor is the entry-level processor of this new series of Intel processors.

Codename
(main article)
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
Sandy Bridge (Desktop) Core i3-21xx 2 3 MB LGA 1155 65 W Direct Media Interface,
Integrated GPU
Core i3-21xxT 35 W
Sandy Bridge (Mobile) Core i3-2xx0M rPGA-988B
BGA-1023
Core i3-2xx7M BGA-1023 17 W

Core i5

In January 2011, Intel released new quad-core Core i5 processors based on the "Sandy Bridge" microarchitecture at CES 2011. New dual-core mobile processors and desktop processors arrived in February 2011.

The Core i5-2xxx line of desktop processors are mostly quad-core chips, with the exception of the dual-core Core i5-2390T, and include integrated graphics, combining the key features of the earlier Core i5-6xx and Core i5-7xx lines. The suffix after the four-digit model number designates unlocked multiplier (K), low-power (S) and ultra-low-power (T).

The desktop CPUs now all have four non-SMT cores (like the i5-750), with the exception of the i5-2390T. The DMI bus is running at 5 GT/s.

The mobile Core i5-2xxxM processors are all dual-core and hyper-threaded chips like the previous Core i5-5xxM series, and share most of the features with that product line.

Codename
(main article)
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
Sandy Bridge (Desktop) Core i5-2xxx
Core i5-2xxxK
4 6 MB LGA 1155 95 W Direct Media Interface,
Integrated GPU
Core i5-2xxxS 65 W
Core i5-25xxT 45 W
Core i5-23xxT 2 3 MB 35 W
Sandy Bridge (Mobile) Core i5-2xxxM rPGA-988B
BGA-1023
Core i5-2xx7M BGA-1023 17 W

Core i7

The Core i7 brand remains the high-end for Intel's desktop and mobile processors, featuring the Sandy Bridge models with the largest amount of L3 cache and the highest clock frequency. Most of these models are very similar to their smaller Core i5 siblings. The quad-core mobile Core i7-2xxxQM/XM processors follow the previous "Clarksfield" Core i7-xxxQM/XM processors, but now also include integrated graphics.

Codename
(main article)
Brand name (list) Cores L3 Cache Socket TDP Process I/O Bus Release
Date
Sandy Bridge-E (Desktop) Core i7-39xxX 6 15 MB LGA 2011 130 W 32 nm Direct Media Interface November 2011
Core i7-39xxK 12 MB
Core i7-38xx 4 10 MB
Sandy Bridge (Desktop) Core i7-2xxxK, i7-2xxx 8 MB LGA 1155 95 W Direct Media Interface,
Integrated GPU
January 2011
Core i7-2xxxS 65 W
Sandy Bridge (Mobile) Core i7-2xxxXM rPGA-988B
BGA-1023
55 W
Core i7-28xxQM 45 W
Core i7-2xxxQE, i7-26xxQM, i7-27xxQM 6 MB
Core i7-2xx0M 2 4 MB 35 W February 2011
Core i7-2xx9M BGA-1023 25 W
Core i7-2xx7M 17 W

Ivy Bridge (3rd gen) microarchitecture-based

Ivy Bridge is the 3rd generation Core processor microarchitecture.

Core i3

The Ivy Bridge-based Core-i3-3xxx line is a minor upgrade to 22 nm process technology and better graphics.

Codename
(main article)
Brand name (list) Cores L3
Cache
Socket TDP I/O Bus
Ivy Bridge (Desktop) Core i3-32xx 2 3 MB LGA 1155 55 W Direct Media Interface,
Integrated GPU
Core i3-32xxT 35 W
Ivy Bridge (Mobile) Core i3-3xx0M rPGA-988B
BGA-1023
Core i3-3xx7U BGA-1023 17 W
Core i3-3xx9Y 13 W

Core i5

Codename
(main article)
Brand name (list) Cores L3
Cache
Socket TDP I/O Bus
Ivy Bridge (Desktop) Core i5-3xxx
Core i5-3xxxK
4 6 MB LGA 1155 77 W Direct Media Interface,
Integrated GPU
Core i5-3xxxS 65 W
Core i5-35xxT 45 W
Core i5-34xxT 2 3 MB 35 W
Ivy Bridge (Mobile) Core i5-3xx0M rPGA-988B
BGA-1023
Core i5-3xx7U BGA-1023 17 W
Core i5-3xx9Y 13 W

Core i7

Codename
(main article)
Brand name (list) Cores L3 Cache Socket TDP Process I/O Bus Release
Date
Ivy Bridge-E (Desktop) Core i7-4960X 6 15MB LGA2011 130 W 22 nm Direct Media Interface September 2013
Core i7-4930K 12MB
Core i7-4820K 4 10MB
Ivy Bridge (Desktop) Core i7-37xx, i7-37xxK 8 MB LGA 1155 77 W Direct Media Interface,
Integrated GPU
April 2012
Core i7-37xxS 65 W
Core i7-37xxT 45 W
Ivy Bridge (Mobile) Core i7-3xxxXM 55 W
Core i7-38xxQM 45 W
Core i7-36x0QM, i7-3xx0QE, i7-36x5QM,
i7-3xx5QE, i7-37xxQM
6 MB
Core i7-3xx2QM, i7-3xx2QE 35 W
Core i7-3xxxM 2 4 MB
Core i7-3xxxLE 25 W
Core i7-3xx7U, i7-3xx7UE 17 W
Core i7-3xx9Y 13 W January 2013

Haswell (4th gen) microarchitecture-based

Haswell is the 4th generation Core processor microarchitecture, and was released in 2013.

Core i3

Codename
(main article)
Brand name (list) Cores L3 Cache GPU Model Socket TDP Process I/O Bus Release
Date
Haswell-DT (Desktop) Core i3-43xx 2 4 MB HD 4600 LGA 1150 54 W 22 nm Direct Media Interface,
Integrated GPU
September 2013
Core i3-43xxT, Core i3-4xxxTE 35 W
Core i3-41xx 3 MB HD 4400 54 W
Core i3-41xxT 35 W
Haswell-MB (Mobile) Core i3-4xx2E HD 4600 BGA 1364 25 W
Core i3-4xx0E 37 W
Core i3-4xxxM Socket G3
Core i3-4xx8U Iris 5100 BGA 1168 28 W June 2013
Core i3-4xx0U, Core i3-4xx5U HD 4400 15 W
Core i3-4xxxY HD 4200 11.5 W

Core i5

Codename
(main article)
Brand name (list) Cores L3 Cache GPU Model Socket TDP Process I/O Bus Release Date
Haswell-DT (Desktop) Core i5-4xxx, i5-46xxK 4 6 MB HD 4600 LGA 1150 84 W 22 nm Direct Media Interface,
Integrated GPU
June 2013
Core i5-4xxxS 65 W
Core i5-46xxT 45 W
Core i5-45xxT, Core i5-45xxTE 2 4 MB 35 W
Core i5-4xxxR 4 Iris Pro 5200 BGA 1364 65 W
Haswell-MB (Mobile) Core i5-4xxxH 2 3 MB HD 4600 47 W September 2013
Core i5-4xx2E 25 W
Core i5-4xx0E 37 W
Core i5-4xxxM Socket G3
Core i5-4xx8U Iris 5100 BGA1168 28 W June 2013
Core i5-4x50U HD 5000 15 W
Core i5-4x00U HD 4400
Core i5-4xxxY HD 4200 11.5 W

Core i7

Codename
(main article)
Brand name (list) Cores L3 Cache GPU Model Socket TDP Process I/O Bus Release
Date
Haswell-E (Desktop)[46] Core i7-5960X 8 20 MB N/A LGA 2011-3 140 W 22 nm Direct Media Interface September 2014
Core i7-5930K 6 15 MB
Core i7-5820K
Haswell-DT (Desktop) Core i7-47xx, i7-47xxK 4 8 MB HD 4600 LGA 1150 84 W Direct Media Interface,
Integrated GPU
June 2013
Core i7-47xxS 65 W
Core i7-47x0T 45 W
Core i7-47x5T 35 W
Core i7-47xxR 6 MB Iris Pro 5200 BGA 1364 65 W
Haswell-MB (Mobile) Core i7-4x50HQ, Core i7-4x60HQ
Core i7-4x50EQ, Core i7-4x60EQ
47 W
Core i7-47x2HQ, Core i7-47x2EQ
Core i7-470xHQ, Core i7-470xEQ
HD 4600 37 W
47 W
Core i7-47x2MQ
Core i7-470xMQ
Socket G3 37 W
47 W
Core i7-49xxMQ, Core i7-4xxxXM 8 MB 57 W
Core i7-4xxxM 2 4 MB 35 W September 2013
Core i7-4xx8U Iris 5100 BGA 1168 28 W June 2013
Core i7-4x50U HD 5000 15 W
Core i7-4x00U HD 4400
Core i7-4xxxY HD 4200 11.5 W

Broadwell (5th gen) microarchitecture-based

Broadwell is the 5th generation Core processor microarchitecture, and was released by Intel on September 6, 2014, and began shipping in late 2014. It is the first to use a 14 nm chip.[47] Additionally, mobile processors were launched in January 2015[48] and Desktop Core i5 and i7 processors were released in June 2015.[49]

Core i3

Codename
(main article)
Brand name (list) Cores L3 Cache GPU Model Socket TDP Process I/O Bus Release
Date
Broadwell-U (Mobile) Core i3-5xx7U 2 3 MB Iris 6100 BGA 1168 28 W 14 nm Direct Media Interface,
Integrated GPU
January 2015
Core i3-5xx0U, Core i3-5xx5U HD 5500 15 W

Core i5

Codename
(main article)
Brand name (list) Cores L3 Cache GPU Model Socket TDP Process I/O Bus Release
Date
Broadwell-DT (Desktop)[49] Core i5-5675C 4 4 MB Iris 6200 LGA 1150 65 W 14 nm Direct Media Interface,

Integrated GPU

June 2015
Core i5-5675R
Core i5-5575R
Broadwell-U (Mobile) Core i5-5xx7U 2 3 MB Iris 6100 BGA 1168 28 W 14 nm January 2015
Core i5-5x50U HD 6000 15 W
Core i5-5x00U HD 5500

Core i7

Codename
(main article)
Brand name (list) Cores/Threads L3 Cache GPU Model Socket TDP Process I/O Bus Release
Date
Broadwell-DT (Desktop)[49] Core i7-5775C 4/8 6 MB Iris 6200 LGA 1150 65 W 14 nm Direct Media Interface,

Integrated GPU

June 2015
Core i7-5775R
Broadwell-U (Mobile) Core i7-5xx7U 2/4 4 MB Iris 6100 BGA 1168 28 W January 2015
Core i7-5x50U HD 6000 15 W
Core i7-5x00U HD 5500
Broadwell-E (Desktop) Core i7-6800K 6/12 15 MB N/A LGA 2011-3 140 W Direct Media Interface Q2'16
Core i7-6850K
Core i7-6900K 8/16 20 MB
Core i7-6950X 10/20 25 MB

Core M

Codename
(main article)
Brand name (list) Cores L3 Cache GPU Model Socket TDP Process I/O Bus Release
Date
Broadwell-Y (Mobile) Core M-5Yxx 2 4 MB HD 5300 BGA 1234 4.5 W 14 nm Direct Media Interface,
Integrated GPU
September 2014

Skylake (6th gen) microarchitecture

Skylake is the 6th generation Core processor microarchitecture, and was launched in August 2015. Being the successor to the Broadwell line, it is a redesign using the same 14 nm manufacturing process technology. However the redesign has better CPU and GPU performance and reduced power consumption. Intel also disabled overclocking non -K processors.

Core i3

Codename

(main article)

Brand name Cores/Threads L3 Cache GPU Model Socket TDP Process I/O Bus Release Date
Skylake-DT (Desktop) Core i3-6098P 2/4 3 MB HD 510 LGA 1151 54 W 14 nm Direct Media Interface,

Integrated GPU

December 2015
Core i3-6100 HD 530 51 W September 2015
Core i3-6100T 35 W
Core i3-6300 4 MB 51 W
Core i3-6320
Core i3-6300T 35 W
Skylake-U (Mobile) Core i3-6100U 3 MB FBGA 1356 15 W
Core i3-6100H 35 W
Core i3-6167U 28 W

Core i5

Codename

(main article)

Brand name Cores/Threads L3 Cache GPU Model Socket TDP Process I/O Bus Release Date
Skylake-DT (Desktop) Core i5-6400 4/4 6 MB HD 530 LGA 1151 65 W 14 nm Direct Media Interface,

Integrated GPU

September 2015
Core i5-6500
Core i5-6600
Core i5-6600K 91 W
Core i5-6xx0T 35 W
Core i5-6xx0R June 2016
Core i5-6402P HD 510 65 W December 2015
Skylake-U (Mobile) Core i5-6200U 2/4 3 MB HD 520 FCBGA 1356 15 W September 2015
Core i5-6260U 4 MB Iris 540
Core i5-62x7U Iris 550 28 W
Core i5-6300U HD 520 15 W
Core i5-6360U Iris 540 9.5 W

Core i7

Codename

(main article)

Brand name Cores/Threads L3 Cache GPU Model Socket TDP Process I/O Bus Release Date
Skylake-DT (Desktop) Core i7-6700 4/8 8 MB HD 530 LGA 1151 65 W 14 nm Direct Media Interface,

Integrated GPU

September 2015
Core i7-6700T 35 W
Core i7-6700K 91 W August 2015
Core i7-6785R Iris Pro 580 65 W May 2016
Skylake-U (Mobile) Core i7-6x00U 2/4 4 MB HD 520 FCBGA 1356 15 W September 2015
Core i7-6x60U Iris 540
Core i7-6567U Iris 550 28 W
Core i7-6600U HD 520 25 W
Core i7-6650U Iris 540 15 W

See also

References

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